GMAP
Glittery Metal Alloy Paste
- Excellent wetting and surface conformity
- Stable thermal resistance at low pressure
- 100°C / 200-hour anti-sagging test
TRIPOD THERMAL01 — LIQUID METAL PASTES
Better heat transfer.
Easier to apply.
GMAP and SMAP combine metal-alloy heat transfer with paste-like handling, superior wetting, and high-temperature stability.
02 — WHY METAL PASTE
Liquid-metal performance.
Made easier to apply.
Conventional liquid metals have high surface tension and can migrate. Tripod metal alloy pastes improve coating and wetting, helping the material remain where heat transfer is required.
03 — TWO MATERIAL SYSTEMS
One portfolio.
TIM 1 through TIM 2.
Actual GMAP dropletSMAP
Superior Metal Alloy Paste
- Designed for package-level interfaces
- Passed five high-temperature reflow cycles
- Process peak above 260°C
04 — PRODUCT DETAILS
Select by interface
and process.
GMAP and SMAP address different thermal-interface locations. Select the material according to coating, conformity, resistance, and reflow requirements.
PARAMETERGMAPSMAP
InterfaceTIM 1.5 / TIM 2TIM 1
Primary use
Ultra-thin interface between chip and heat sink
Package interface and high-temperature process
Material behavior
Easy spreading, wetting, and surface conformity
Retains material within the defined area after heat exposure
Validation
>15 W/m·K; 100°C / 200-hour anti-sagging test
>260°C reflow; five-cycle reflow test
Low-pressure conformity
GMAP thermal resistance is less sensitive to applied pressure, supporting ultra-thin interfaces and limited clamping force.
Vertical stability
GMAP has been evaluated for high-temperature sagging and thermal-resistance change before and after drop testing.
Production process
SMAP is designed for high-temperature SMT reflow and package-level production requirements.
WETTING × CONFORMITY
Better conformity.
More stable heat transfer.
GMAP combines strong wetting and conformity to fill microscopic gaps. Under ultra-thin TIM conditions, it maintains stable thermal resistance even as applied pressure changes.
Superior wetting→Complete coverage→Stable resistance
05 — SPACE-GRADE
From terrestrial systems
to extreme environments.
Thermal materials must address more than conductivity: high temperature, vacuum, radiation, shock, and production processes also matter.
Potential for space environments
GMAP metal materials offer a boiling point above 2,000°C and extremely low vapor pressure, reducing evaporation risk in vacuum. Inorganic metallic bonding also offers potential resistance to radiation aging.
Wide temperature range
Compared with organic materials susceptible to thermal aging, metal alloy paste supports demanding ambient and process temperatures.
1-meter drop evaluation
Free-fall tests at 1, 3, and 5 drops assess appearance, leakage, and thermal-resistance change before and after impact.
100°C / 200-hour anti-sagging
High-temperature observations on heat-sink, chip-side, and glass surfaces verify stability in vertical orientation.
Reflow above 260°C
After five mass-reflow cycles, SMAP remained within the defined area for TIM 1 and SMT process requirements.
Beyond materials
Tripod supports TIM development, thermal-module design, simulation, performance evaluation, manufacturing, and automation.
Space-environment statements describe material characteristics and application potential, not certification. Qualification must be completed for each mission profile.
06 — VALIDATED IN SYSTEMS
Not just a number.
Lower chip temperatures.
Gaming graphics card
Average GPU temperature of GMAP+ versus the original interface material.
RTX 3060 Ti
FurMark, 25°C ambient, 100-hour load.
PS5
Maximum T3 temperature of GMAP+ versus original liquid metal.
Results were obtained on specific platforms and test conditions. Tripod can support evaluation of interface, thickness, pressure, and thermal-module conditions before adoption.
Liquid metalHigher surface tension and slower spreading
GMAP metal alloy pasteEasier coating and wetting of the contact surface
07 — WETTING COMPARISON
Coating behavior,
clearly visible.
GMAP's paste form makes it easier to spread the material and cover the contact area.
Actual Tripod coating test.
08 — APPLICATIONS
From high-power computing
to extreme environments.
AI / Servers
Chip-to-thermal-module interfaces for high-power CPUs, GPUs, and accelerators.
GPUs / Graphics Cards
Lower chip temperatures and stable heat transfer under sustained workloads.
Gaming Consoles
Thermal-interface solutions for high-heat-flux chips in constrained spaces.
Automotive Electronics
Thermal management for vibration, vertical orientation, and wide-temperature conditions.
Semiconductor Packaging / SMT
SMAP supports TIM 1 and mass-reflow processes above 260°C.
Aerospace / Extreme Environments
Material evaluation for vacuum, radiation, and mission-specific temperature profiles.
08 — TALK TO US
Thermal problem?
Talk to Tripod.
Thermal Interface Materials Div.
Chief Section Manager